Potting Compound 110 is a two-part silicone-based encapsulant, designed for high-performance protection of electronic components. Comprising Part-A (Grey) and Part-B (White), this compound offers excellent electrical insulation, flexibility, and resistance to moisture, vibration, and thermal cycling. Once mixed and cured, it forms a durable, rubber-like protective layer ideal for sensitive circuits, PCBs, LED drivers, power supplies, and more.

Features of Potting Compound 110:

1. Two-part silicone formulation (Grey + White)
2. High dielectric strength and flexibility
3. Strong moisture, thermal, and chemical resistance
4. Excellent adhesion to metals, plastics, and PCBs
5. Low shrinkage and good flow characteristics for easy application

Specifications:

Property	Specifications/Conditions	Results
Appearance – Part A	-	White Fluid
Appearance – Part B	-	Grey Fluid
Viscosity Part A	Centipoise	2500 – 3200
Viscosity Part B	Centipoise	2500 – 3200
Density Part A	gm/cc	1.5 – 1.65
Density Part B	gm/cc	1.5 – 1.65
After Mix Properties
Property	Specifications/Conditions	Results
Mixing Ratio	By Weight	1:1
Mixing Ratio	By Volume	1:1
Mixed Viscosity	Centipoise	2500 – 3200
Working Time @ 30°C	Minutes	40 – 60
Curing Time @ 30°C	Hours	2 – 4
Curing Time @ 80°C	Minutes	15
Hardness	Shore A	>40
Thermal Conductivity	W/mK	0.8
Dielectric Strength	kV/mm	>21
Flammability Rating	UL 94	V0 Compliant

 

Application Process:

1. Surface should be clean before use.
2. Ensure component A and component B are homogenised well before mixing.
3. Mix both component A and component B in the ratio of 1: 1 by weight or by volume.
4. Pour the mixture into the desired container ensuring there is minimal air entrapment.
5. Pouring/dispensing should be done under vacuum if the electronic module being potted has many voids.
6. Leave the mixture to cure at room temperature or at an elevated temperature for faster cure.

 Package Includes:

1 x Potting Compound 110 – Part A (Grey, 1kg)

1 x Potting Compound 110 – Part B (White, 1kg)